BGA Rework Station FD-6900C
Model: FD-6900C
FD-6900C Specifications
|
Total Power |
4800W |
|
Top heater |
800W |
|
Bottom heater |
2nd heater 1200W, 3rd IR heater 2700W |
|
Temperature Zones |
Three Zones |
|
Voltage |
AC220V±10%, 50/60Hz |
|
Positioning |
V-groove, PCB support can be adjusted in any direction with
external universal fixture |
|
Temperature control |
K Sensor Closed loop, heating independently |
|
Temp accuracy |
±2℃ |
|
Temperature control Settings |
6-8 levels of variable(up/down) and constant temperature controls
Massive storage of temperature curves |
|
PCB size |
Max 500×400 mm Min 22×22 mm |
|
BGA chip |
2×2-80×80mm |
|
Minimum chip spacing |
0.15mm |
|
External Temperature Sensor |
1pcs (optional) |
|
vacuum system |
Support, internal vacuum pump and external
vacuum pen |
|
Touch screen |
7.0 inch, HD Resolution, Panel Visa touch screen |
|
Camera magnification |
HD Resolution, 3-54× |
|
Optical system |
CCD color high-definition imaging system, manually |
|
Monitor |
15 Inch |
|
Electrical materials |
Taiwan touch screen + PLC + heating plate
(Germany+high precision intelligent temperature
control module |
|
Dimensions |
L800×W900×H950 mm |
|
Net weight |
45kg |
FD-6900C Main Functions
1. Embedded Industrial PC, high definition touch screen interface, PLC control, and
instant profile analysis function. Realtime settings and actual temperature profile
display can be used to analyzed and correct parameters if necessary.
2. It could watch the solder ball melt progress on the monitor, very useful,
with camera you can see if the PCB flex or not and you can see when the solder
start to solder.
3. It uses precise Ktype close circuit control and automatic temperature
adjustment system, with PLC and temperature module to enable
precision temperature control of ±2 deg C. External temperature sensor enables
temperature monitoring and accurate analysis of real time temperature profile.
4. V-groove PCB supports for rapid, convenience and accurate positioning that fits for all
kinds of PCB board.
5. Flexible and convenient removable fixture on the PCB board which protects and
prevent damage to PCB. It can also adapt to rework various BGA packages.
6. Various sizes of BGA nozzles, which can be adjusted 360 degree for easy
installation and replacement;
7. Three temperature areas can independently heat and are multiple controllable and
adjustable to ensure best integration
of different temperature areas. Heating temperature, time, angle, cooling and
vacuuming can all be set on the interface.
8. There are 68 levels of variable and constant temperature controls. Massive
storage of temperature curves which are Instant accessible
according to different BGA. Curve analysis, setting and adjustment are all accessible
via touch screen. Three heating areas
adopt independent PID calculation to control heating process to enable more accurate
and precise temperature control.
9. It uses high powered blower to enable fast cooling of PCB board and prevent it from
deformation. There are also internal
vacuum pump and external vacuum pen to assist with fetching the BGA chip.
10. Including Voice "early warning" function. 5-10 seconds before the completion of uninstalling or welding, voice reminder / warning
to get the workers prepared. Cooling system
will start after vertical wind stopped heating. When the temperature drops to room
temperature, the cooling process will stop,
so that the machine will not age after heated up.
11. CE certification, with emergency switch and automatic power-off protection device when emergency happens.
